scia Systems GmbH
About us
scia Systems – From nano to Infinity
Founded in 2013, scia Systems is a technology leader in thin-film process equipment based on advanced ion beam and plasma technologies. The systems are used for coating, etching, and cleaning processes with nanometer resolution and have been successfully implemented in various high-tech industries worldwide, including microelectronics, MEMS, and precision optics industries. More: https://www.scia-systems.com/
Address
Clemens-Winkler-Str. 6c
09116 Chemnitz
Germany
E-mail: info@scia-systems.com
Phone: +49 3713 35610
Internet: www.scia-systems.com
Contact person:
scia Trim Systems - Surface Modification using Ion Beam Trimming for Next-Generation Applications
The scia Trim systems are high-volume production systems for high-precision surface trimming of wafers. They are used to achieve high-quality surface structures without limitations on film and wafer materials. The machine layout is optimized for high throughput and low maintenance.
The scia Trim systems guarantee film thickness homogeneity to an atomic level of 0.1 nm. Unlike conventional mechanical polishing methods, ion beam trimming operates without physical contact. Therefore, it prevents mechanical stress or damage to surrounding areas, increasing the device's reliability.
scia Mill Systems - Full Surface Ion Beam Etching with Nanometer Precision
The scia Mill systems are high-volume production systems that utilize Ion Beam Etching (IBE) for highly precise surface processing of complex multilayer materials. The systems offer excellent surface uniformity for wafer sizes up to 200 mm. Typical applications are 2D and 3D structuring of magnetic memory (MRAM), sensors, MEMS, and compound semiconductors.
