SEMICON West 2026Products & Services Laser-Based Sample Preparation on Full-Wafer- and Board-Level

Laser-Based Sample Preparation on Full-Wafer- and Board-Level

Our field-proven microPREP^® systems accelerate sample preparation for a wide range of failure analysis methods, including TEM, SEM, APT, XRM, and micromechanical testing. The latest development, the microPREP^® L, can prepare specimens on bigger samples like 12” wafers or system-level boards. These can even be prepared across multiple areas of the same sample in a single run, without process restarts.

Free your FIB/SEM for what it does best – speed up your time-to-sample with laser-based sample preparation with microPREP® systems.

Further reading

microPREP® L can prepare specimens on bigger samples like 12” wafers or system-level boards.

microPREP® L accelerates delayering and localized device opening in failure analysis and quality assurance.

With the microPREP® L, cross-sections for failure analysis of integrated circuits can be prepared within minutes.

Pre-preparing TEM lamellae with the microPREP® L helps overcome bottlenecks in FIB/SEM systems.

The microPREP® L efficiently prepares site-specific pillar structures for APT and micro-CT directly within the sample.

Laser-Based Sample Preparation on Full-Wafer- and Board-Level

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