Selective laser annealing enables targeted activation of functional layers with minimal thermal impact on surrounding structures – a key technology in advanced semiconductor production. Our systems offer outstanding process uniformity, repeatability, and efficiency at an industrial scale.

The microPRO XS OCF enables accurate activation of ohmic contacts on SiC wafers for power device applications. It delivers application-optimized annealing at the highest technological level while keeping CoO low.

microPREP® PRO FEMTO is 3D-Micromac’s high-precision laser ablation system specifically engineered for advanced sample preparation tasks in semiconductor failure analysis and device characterization. Equipped with a femtosecond laser, it enables high-resolution cross-sectioning and delayering with minimal thermal or mechanical impact—ideal for the preparation of complex, multilayer semiconductor structures.

Unlike conventional methods such as mechanical polishing or ion beam milling, microPREP® PRO FEMTO uses ultrashort laser pulses to selectively remove material while preserving structural integrity and analytical fidelity. Compared to FIB systems, the laser-based process is significantly faster, especially when preparing larger areas or coarse material removal is required. This makes it a powerful, non-destructive and time-saving alternative—or complementary front-end tool—to traditional FIB and other established preparation techniques.

The system is also capable of processing larger samples and packages, supporting a broad range of specimen geometries and materials—including metals, semiconductors, ceramics, polymers, and advanced composites. A user-friendly software environment with predefined workflows ensures reproducibility and integration into existing analysis workflows such as SEM, TEM, APT, X-ray tomography, and micromechanical testing.

By reducing time-to-sample and minimizing tool bottlenecks, microPREP® PRO FEMTO increases throughput, lowers cost of ownership, and enhances lab efficiency—especially in semiconductor labs dealing with growing sample volumes and complexity.

Selective laser annealing enables targeted activation of functional layers with minimal thermal impact on surrounding structures – a key technology in advanced semiconductor production. Our systems offer outstanding process uniformity, repeatability, and efficiency at an industrial scale.

3D-Micromac's microVEGA  xMR precisely programms TMR & GMR sensors by selective pinning of the magnetic orientation of the reference layer. The award-winning microVEGA  xMR system is used worldwide in the high-volume production of monolithically integrated sensor chips.

3D-Micromac designed the microVEGA  FC system for high-precision laser processing of semiconductor wafers during continuous motion. With 3D calibration, dynamic focus correction, and a positioning accuracy of 150 nm at 400 mm/s, the system delivers top-level precision at the highest throughput.

It combines speed, accuracy, and stability for the most demanding laser processing tasks. Its user-friendly control and seamless integration into existing production lines ensure maximum availability and support long-term process efficiency while keeping unit costs low.

Typical applications include trimming of digital potentiometers, programming logic structures, or repairing embedded memory cells—but a lot more is imaginable. Let's get in contact to discuss your application that needs ultra-precise laser processing.

Our field-proven microPREP^® systems accelerate sample preparation for a wide range of failure analysis methods, including TEM, SEM, APT, XRM, and micromechanical testing. The latest development, the microPREP^® L, can prepare specimens on bigger samples like 12” wafers or system-level boards. These can even be prepared across multiple areas of the same sample in a single run, without process restarts.

Free your FIB/SEM for what it does best – speed up your time-to-sample with laser-based sample preparation with microPREP® systems.