Laser Link Trimming: Ensuring fail-safe integrity and long-term robustness of analog, power-management & mixed signal ICs through permanent hardware configuration
Exhibitor
3D-Micromac AG
Laser Link Trimming (LLT) enables permanent hardware configuration for analog, power-management and mixed-signal ICs in automotive, industrial, aerospace and other high-reliability applications. Typical devices include gate drivers, BMS ICs and high-side switches, where LLT supports variant configuration and permanent hardware limits for safety-critical and fail-safe functions.
Complementing rewritable NVM, Trim-DACs and electrically programmed OTP solutions, LLT creates irreversible, tamper-resistant configurations by modifying predefined metal links – without electrical programming stress or the need for dedicated memory structures.
microVEGA™ FC enables high-throughput wafer-level LLT on a production-grade platform for semiconductor manufacturing, combining ±200 nm positioning accuracy (3σ), closed-loop process control and on-the-fly processing at up to 400 mm/s for an exceptional balance of speed, precision and process stability.
microVEGA FC processes semiconductor wafers during continuous motion at ultra-high precision.