microPREP® PRO FEMTO is 3D-Micromac’s high-precision laser ablation system specifically engineered for advanced sample preparation tasks in semiconductor failure analysis and device characterization. Equipped with a femtosecond laser, it enables high-resolution cross-sectioning and delayering with minimal thermal or mechanical impact—ideal for the preparation of complex, multilayer semiconductor structures.

Unlike conventional methods such as mechanical polishing or ion beam milling, microPREP® PRO FEMTO uses ultrashort laser pulses to selectively remove material while preserving structural integrity and analytical fidelity. Compared to FIB systems, the laser-based process is significantly faster, especially when preparing larger areas or coarse material removal is required. This makes it a powerful, non-destructive and time-saving alternative—or complementary front-end tool—to traditional FIB and other established preparation techniques.

The system is also capable of processing larger samples and packages, supporting a broad range of specimen geometries and materials—including metals, semiconductors, ceramics, polymers, and advanced composites. A user-friendly software environment with predefined workflows ensures reproducibility and integration into existing analysis workflows such as SEM, TEM, APT, X-ray tomography, and micromechanical testing.

By reducing time-to-sample and minimizing tool bottlenecks, microPREP® PRO FEMTO increases throughput, lowers cost of ownership, and enhances lab efficiency—especially in semiconductor labs dealing with growing sample volumes and complexity.