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SEMICON West 2026Products & Services Modular Grinding Concept for SiC Puck Production

Modular Grinding Concept for SiC Puck Production

Exhibitor
Geibel & Hotz GmbH

GH SEED DOME GRINDER

The GH SEED DOME GRINDER is used to grind the flat surfaces of the boule. The surfaces can be ground precisely in alignment with the crystal lattice structure – without any angled clamping of the workpiece. This reduces setup time, increases accuracy, and ensures maximum process stability.

GH OD NOTCH GRINDER

The GH OD NOTCH GRINDER is used to precisely grind the diameter of the boules. The exact position of the reference surface is determined based on the measurement results. Depending on customer requirements, either a notch or a flat is applied there. This creates a reliable reference surface for the subsequent process steps in wafer production.

Smart CNC Control Software (Standard on Both Machines)

Both the GH SEED DOME GRINDER and the GH OD NOTCH GRINDER operate on our future-proof, unified CNC platform, featuring a proprietary control software developed entirely in-house by Geibel & Hotz. Specifically engineered to optimize SiC processing workflows, it enables the automatic transfer of external workpiece measurement data directly into precise process parameters. For manual adjustments, no complex G-Code programming is required; instead, parameters are entered quickly and safely via an intuitive, dialog-guided user interface.

Further reading
Modular Grinding Concept for SiC Puck Production

Modular Grinding Concept for SiC Puck Production

Modular Grinding Concept for SiC Puck Production

GH SEED DOME GRINDER

GH OD NOTCH GRINDER

Flat surface grinding of SiC boules

High-precision clamping system for OD grinding of SiC boules

High-precision clamping system for notch or flat grinding of SiC boules

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