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SEMICON West 2026Products & Services combo 350 pogo tower

combo 350 pogo tower

Exhibitor
esmo AG

This state-of-the-art interfacing solution is designed to provide maximum flexibility, extended application range, and cost-effective integration for semiconductor test environments. With its modular pin block design and freely configurable layout, the system can be tailored precisely to customer-specific requirements while supporting reliable performance and simplified maintenance.

Flexible design for a wide application range

The system offers an extended application space and is built around a modular pin block concept that enables highly flexible configuration. Thanks to freely configurable spacing, the interfacing layout can be adapted to a broad variety of test setups and device requirements.

To meet specific application needs, various pin module options are available on customer request. Depending on the configuration, the system can be designed for 800 to 4,800 pins, allowing it to support both smaller and highly demanding test interfaces.

Modular architecture for easier maintenance

A key advantage of the solution is its modular design, which allows for easy pin and block replacement, straightforward expansion, and simplified servicing. This not only reduces maintenance effort, but also supports longer system life and lower total operating costs.

The modular approach also makes it easier to adapt the interface over time as operational requirements evolve.

Broad compatibility and efficient integration

The system is designed for compatibility with all conventional PIB boards and standard probers, making integration into existing test environments simple and efficient. This broad compatibility helps reduce implementation effort while protecting existing infrastructure investments.

As a result, the solution offers a cost-effective and innovative interfacing platform for modern semiconductor testing applications.

Cold temperature cover

A cold temperature cover is available to support applications operating under demanding thermal conditions, helping maintain reliable performance in low-temperature environments.

Optional features

For enhanced performance verification, setup optimization, and quality control, the following optional features are available:

  • Certified contact resistance measuring for premium performance

  • Debugging tool

  • Planarity and pin compression measurement tool

  • Pitch point position check tool

Key benefits

  • Extended application space

  • Modular pin block design

  • Freely configurable spacing

  • Configurable from 800 to 4,800 pins

  • Customer-specific pin module options

  • Easy pin and block replacement

  • Simplified maintenance and expansion

  • Compatible with all conventional PIB boards and standard probers

  • Cost-effective, advanced interfacing solution

  • Cold temperature cover available

  • Optional tools for measurement, debugging, and performance verification

This modular interfacing solution combines flexibility, compatibility, and maintainability in a modern platform for semiconductor test applications. With configurable pin counts, adaptable spacing, and a broad range of optional validation tools, it provides a reliable and future-ready solution for demanding interfacing requirements.

Further reading

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