The X-change Cart is a dedicated, semi-automated Device Interface Board (DIB) exchange system designed to make load board changeovers faster, safer, and more reliable in semiconductor test environments.

Built for modern high-mix test floors, the X-change Cart enables a complete load board change by a single operator in under one minute. It replaces physically demanding manual handling with a structured, HMI-controlled process that improves repeatability, reduces operator strain, and minimizes the risk of board damage during exchange.

Fast, safe, and repeatable board handling

Frequent load board changeovers are a critical part of day-to-day operations in semiconductor testing. Manual handling can slow down workflows, increase the risk of handling errors, and place unnecessary physical demands on operators. The X-change Cart addresses these challenges with a dedicated exchange solution engineered for efficiency and production-floor reliability.

Using an intuitive semi-automated process, a single operator can lock, rotate, and transfer the board to the tester quickly and safely. The system is designed to transport two load boards simultaneously, enabling rapid exchange in real production scenarios.

Designed for real production environments

The X-change Cart has been developed with the practical constraints of semiconductor test floors in mind. Its mechanical flexibility supports smooth operation even in tight and complex layouts:

• 180° rotation at the locking mechanism

• 180° Y-axis rotation

• 90° Z-axis / tower swivel

These motion capabilities make the system especially suitable for narrow corridors and space-constrained production areas.

Broad compatibility and easy integration

The X-change Cart is compatible with leading ATE platforms, including Teradyne, Advantest, SPEA, and others. This broad platform compatibility allows seamless integration into existing multi-vendor test environments without requiring major reconfiguration of current setups.

The system can interface with:

• test heads

• probers

• DIB loaders

• storage racks

• maintenance workbenches

This makes the X-change Cart a flexible solution for a wide range of semiconductor test floor applications.

Engineered for reliability and protection

Reliability on the production floor depends on consistent performance in everyday use. The X-change Cart is engineered to ensure safe and stable board handling under real operating conditions. Its ESD-safe construction protects sensitive boards at every point of contact, while integrated sensing and operator guidance help support secure and controlled handling throughout the exchange process.

Ready for future automation

For customers pursuing longer-term automation strategies, the X-change Cart is also available in an optional fully automated configuration. In this version, the interface tower can be mounted onto a customized AGV or AMR, creating a practical pathway toward more autonomous semiconductor test floor operations.

Its modular design also allows additional features and future adaptations to be integrated as operational requirements evolve.

Key features

• Semi-automated DIB exchange system for reliable board loading and unloading

• One-person operation with complete board exchange in under one minute

• Simultaneous transport of two load boards

• Multi-axis rotation for flexible handling in constrained environments

• Compatible with leading ATE platforms such as Teradyne, Advantest, and SPEA

• Interfaces with test head, prober, DIB loader, storage rack, and maintenance workbench

• Tower swivel up to \pm90° for narrow corridors and tight production layouts

• Integrated HMI, sensor detection, safety hand-brake, and modular battery

• Optional configuration for mounting on AGV or AMR

Built for smarter board changeovers

With its combination of speed, operator safety, compatibility, and modularity, the X-change Cart is a practical solution for semiconductor manufacturers looking to improve load board handling and streamline changeover processes on the test floor.

The Apollo Quad Handler is an advanced final test handler designed to close the gap between engineering flexibility and production efficiency. Developed for semiconductor manufacturers facing growing demands for throughput, reliability, and energy efficiency, Apollo sets a new benchmark for final test applications.

Built as a high-performance alternative to energy-intensive legacy systems, Apollo is optimized for the testing of complex semiconductor devices such as SoCs and AI chips. It is designed for applications requiring up to 50,000 devices per day, combining precise thermal performance with strong real-world UPH (units per hour) efficiency.

Engineered for flexible, efficient final test

Apollo was developed in response to market demand for a handler that brings the flexibility of an engineering platform into higher-volume test environments. Building on the success of the esmo talos engineering handler, Apollo offers a scalable solution for engineering trials, low- to mid-volume production, and selected higher-throughput applications where ultra-high parallel testing is not required.

The result is a handler that delivers strong performance while helping reduce both investment costs and ongoing operating expenses.

Key features and benefits

• Universal I/O interface
  Supports tray, tube, and tape loading and unloading with flexible module configurations. Apollo is also AMR/AGV-ready for future automation concepts.

• Adaptable device pitch
  Easily configurable for different site pitches via conversion kits, allowing existing loadboards and sockets to be reused and reducing conversion costs.

• Versatile device range

  • Quad-site: for devices from 2.5 x 2.5 mm to 50 x 50 mm

  • Single-site: for larger devices up to 125 x 120 mm (JEDEC tray size)

• Energy-efficient operation
  Low consumption of 200 l/min CDA and 8 l/h LN2 helps reduce operating costs compared to conventional systems.

• Precise thermal control
  Plunger temperature range from -80°C to +225°C for demanding thermal test applications.

• Fast conversion kit changeover
  Tool-less kit changes with automatic transfer of kit-specific parameters from kit to machine via RFID enable quick and reliable setup changes.

• Mixable media options
  Flexible configurations such as tray in / tape out reduce additional handling and inspection steps.
  

Seamless integration into existing test cells

A major advantage of the Apollo Quad Handler is its ability to integrate smoothly into existing ATE environments. The system can adapt to legacy handler-specific hardware interfaces, including existing loadboards and site pitches, allowing customers to upgrade test cells without replacing established infrastructure.

This makes Apollo especially attractive for companies seeking to modernize operations while keeping capital expenditure under control.

Built for versatility on the test floor

Apollo is designed for maximum flexibility across a wide range of test requirements. It supports multiple I/O module configurations and enables fast transitions between different testing formats with minimal downtime. Thanks to its modular architecture and tool-less conversion kits, on-site reconfiguration can be completed in less than five minutes.

This flexibility makes Apollo well suited for environments where product mix, package type, or test requirements change frequently.

Real-time monitoring for stable performance

To support stable, high-quality operation, Apollo features real-time monitoring capabilities that enable continuous process tracking. Adjustments can be implemented immediately, while detailed reports are generated automatically to simplify performance control and process optimization.

This helps operators maintain peak performance and increases transparency across final test operations.

A practical solution for modern semiconductor testing

The Apollo Quad Handler is designed for chipmakers, foundries, OSAT providers, and test houses that need a handler combining flexibility, throughput, and lower operating costs. By bringing engineering-handler agility into a production-capable platform, Apollo helps streamline workflows, reduce energy consumption, and improve overall efficiency.

As the first final test handler to offer this level of I/O module flexibility, including vision, bulk, and magazine options, Apollo enables highly configurable and efficient testing workflows tailored to evolving production requirements.

With its combination of:

• production-ready flexibility

• strong thermal and throughput performance

• low operating costs

• broad compatibility

• and fast on-site reconfiguration

the Apollo Quad Handler is a forward-looking solution for semiconductor companies aiming to optimize final test without compromising efficiency or quality.

The talos is a user-friendly, state-of-the-art device handling system designed to automate semiconductor engineering test procedures with precision, flexibility, and efficiency. Developed for manufacturers testing increasingly compact and complex microchips, talos combines reliable handling performance, advanced thermal capability, and a modular platform that adapts to a wide range of test requirements.

Built for efficient semiconductor testing

talos is engineered to support demanding semiconductor test applications while remaining easy to operate and highly adaptable. It enables reliable device handling across a broad range of package types and site pitches, allowing users in many cases to continue using their existing load boards and sockets. This reduces setup effort, shortens conversion times, and helps lower overall testing costs.

With its modular system concept, talos can be configured according to individual requirements and intended use cases. It can serve as a flexible engineering handler for changing test scenarios while also supporting efficient, repeatable operations on the test floor.

Advanced thermal control for precise results

At the core of talos is its active thermal control system (ATC), which supports device testing temperatures from -60 °C to +175 °C. Temperature is measured and controlled directly at the contact plunger to ensure the highest possible accuracy during cold and hot testing. This makes talos particularly well suited for tri-temp testing and for applications requiring multiple automated test cycles at different temperatures without user interaction.

For even more precise thermal management, a junction regulation option is available. This enables users to control the device’s core temperature and compensate for power dissipation, further improving temperature accuracy under challenging test conditions.

Flexible handling for mixed media operation

talos supports manual tray, tube, and tape loading and unloading, giving users maximum flexibility in day-to-day operation. Different media types can be combined within the same workflow, enabling mixed media processes and efficient device transfer between formats where required. Additional software-supported resorting functions help simplify handling workflows and improve overall efficiency.

The system also offers free pin1 orientation, which increases flexibility when handling varying device formats and test requirements.

Precision handling and tester compatibility

For accurate and reliable device movement, talos is equipped with a highly accurate 4+1-axis portal pick-and-place robot system. The platform delivers a standard contact force of 350 N, with higher contact force up to 700 N available on request, making it suitable for a broad spectrum of semiconductor test applications.

A major advantage of talos is its broad compatibility: the system is suitable for all testers on the market, making integration into existing test environments straightforward and cost-effective.

Designed for ease of use

talos combines technical capability with intuitive operation. A 15.6-inch widescreen HMI with multi-touch capability provides user-friendly machine control, while an integrated camera system for pick-and-place position teaching supports fast setup and reliable operation. esmo-groupesmo-group.com

The system also supports remote control via Ethernet, allowing users to manage and monitor operations more conveniently. Communication options include RS232 as standard, with optional TCP/IP or GPIB tester interfaces depending on application requirements. esmo-groupesmo-group.com

Compact, modular, and efficient

talos is designed with a small test cell footprint, especially in combination with the esmo phoenix cart, making it a strong fit for space-constrained environments. Its moveable and modular design supports flexible deployment and easy adaptation to changing operational needs.

At the same time, the platform is built for strong long-term performance, offering high MTBF values and low maintenance effort, which contribute to high uptime and lower cost of ownership.

Key features

• Reliable and easy-to-use device handling system

• -60 °C to +175 °C device testing temperature with active thermal control (ATC)

• Tri-temp testing capability

• Multiple automated test cycles at different temperatures without user interaction

• Support for existing boards and sockets in many applications

• Package conversion within a few minutes

• Highly accurate 4+1-axis portal pick-and-place robot system

• Manual tray, tube, and tape loading/unloading

• Free pin1 orientation

• 350 N contact force standard, up to 700 N on request

• 15.6" widescreen HMI with multi-touch capability

• Integrated camera system for position teaching

• FIFO or BIN sort mode with free tray/tube assignment

• Software-supported resorting functions

• Remote control via Ethernet

• RS232, optional TCP/IP or GPIB interfaces

• Small footprint, moveable, and modular system design

• Suitable for all testers on the market

• High MTBF and low maintenance effort
  

The talos combines intuitive operation, precise thermal control, flexible media handling, and a modular architecture in one advanced semiconductor test handler. It is an ideal solution for companies looking to improve engineering test efficiency, reduce setup effort, and handle a wide variety of semiconductor devices with confidence and precision.

The helix-e docking system is a high-precision, software-controlled docking solution designed for reliable alignment, stable contact force, and efficient integration in semiconductor test environments. With its modular architecture, adjustable z-stack, and fine-tuning capabilities in the docked state, helix-e offers a flexible and robust solution for demanding docking applications.

Engineered for stability and repeatability, the system is available in two performance classes — helix-e 30 and helix-e 150 — to support different force and application requirements.

Stable modular design

The helix-e docking system features four docking modules mounted on a rigid base plate, creating a mechanically stable platform for precise and repeatable docking processes. Four guide bushings provide reliable pre-alignment and support accurate positioning before final docking.

Its robust design ensures maximum system stability and compatibility with most common test head types used in the field, making it a practical solution for a broad range of semiconductor test setups.

The system is also designed for simple and efficient installation. In most applications, installation can be completed without the need for an alignment jig, helping reduce setup effort and integration time.

Intelligent control and precise adjustment

A key advantage of helix-e docking is its adjustable, software-controlled z-stack. All four modules are electrically synchronized, ensuring coordinated movement and precise positioning throughout the docking process.

Each module includes individual z-position measurement, allowing highly accurate monitoring and control. The system also supports teach-in functionality for the z stop position, enabling repeatable setup tailored to the specific application.

To simplify alignment relative to the handler, helix-e provides parallel alignment capability as well as fine adjustment of the docking stop position while in the docked state. This means adjustments can be made without undocking, saving time and improving operational efficiency.

For applications requiring additional mechanical reference, an optional mechanical hard stop can also be implemented.

Performance tailored to application needs

helix-e 30

Designed for applications requiring a lower contact force with high accuracy and stability:

• Locking force per module: 30 kgf (approx. 294 N)

• Total locking force (4 modules): 120 kgf (approx. 1176 N)

• Dock adjustment range: 0.0 to 5.0 mm

• Dock time: less than 18 seconds

• Docking accuracy: \pm 0.05 mm

• Repeatability (x, y): \pm 0.05 mm

• Repeatability (z):

  • \pm 0.02 mm (software-controlled)

  • \pm 0.01 mm (with hard stop)

helix-e 150

Designed for higher-force applications requiring maximum holding power and fast docking performance:

• Locking force per module: 150 kgf (approx. 1470 N)

• Total locking force (4 modules): 600 kgf (approx. 5880 N)

• Dock adjustment range: 0.0 to 6.5 mm

• Dock time: less than 12 seconds

• Docking accuracy: \pm 0.05 mm

• Repeatability (x, y): \pm 0.05 mm

• Repeatability (z):

  • \pm 0.02 mm (software-controlled)

  • \pm 0.01 mm (with hard stop)
    

Key benefits

• Four-module docking system on a rigid base plate

• High mechanical stability for precise and repeatable docking

• Software-controlled adjustable z-stack

• Electrical synchronization of all modules

• Individual z-position measurement on each module

• Teach-in function for z stop position

• Fine adjustment in docked state without undocking

• Optional mechanical hard stop

• Compatible with most common test head types

• Efficient installation, typically without alignment jig

• Available in two force classes for different application needs
  

The helix-e docking system combines robust mechanics, precise software control, and application-oriented flexibility in one advanced docking solution. Whether the priority is compact force-controlled docking or high-force performance with maximum stability, helix-e provides the accuracy, repeatability, and ease of adjustment required for modern semiconductor test environments.

This state-of-the-art interfacing solution is designed to provide maximum flexibility, extended application range, and cost-effective integration for semiconductor test environments. With its modular pin block design and freely configurable layout, the system can be tailored precisely to customer-specific requirements while supporting reliable performance and simplified maintenance.

Flexible design for a wide application range

The system offers an extended application space and is built around a modular pin block concept that enables highly flexible configuration. Thanks to freely configurable spacing, the interfacing layout can be adapted to a broad variety of test setups and device requirements.

To meet specific application needs, various pin module options are available on customer request. Depending on the configuration, the system can be designed for 800 to 4,800 pins, allowing it to support both smaller and highly demanding test interfaces.

Modular architecture for easier maintenance

A key advantage of the solution is its modular design, which allows for easy pin and block replacement, straightforward expansion, and simplified servicing. This not only reduces maintenance effort, but also supports longer system life and lower total operating costs.

The modular approach also makes it easier to adapt the interface over time as operational requirements evolve.

Broad compatibility and efficient integration

The system is designed for compatibility with all conventional PIB boards and standard probers, making integration into existing test environments simple and efficient. This broad compatibility helps reduce implementation effort while protecting existing infrastructure investments.

As a result, the solution offers a cost-effective and innovative interfacing platform for modern semiconductor testing applications.

Cold temperature cover

A cold temperature cover is available to support applications operating under demanding thermal conditions, helping maintain reliable performance in low-temperature environments.

Optional features

For enhanced performance verification, setup optimization, and quality control, the following optional features are available:

• Certified contact resistance measuring for premium performance

• Debugging tool

• Planarity and pin compression measurement tool

• Pitch point position check tool

Key benefits

• Extended application space

• Modular pin block design

• Freely configurable spacing

• Configurable from 800 to 4,800 pins

• Customer-specific pin module options

• Easy pin and block replacement

• Simplified maintenance and expansion

• Compatible with all conventional PIB boards and standard probers

• Cost-effective, advanced interfacing solution

• Cold temperature cover available

• Optional tools for measurement, debugging, and performance verification
  

This modular interfacing solution combines flexibility, compatibility, and maintainability in a modern platform for semiconductor test applications. With configurable pin counts, adaptable spacing, and a broad range of optional validation tools, it provides a reliable and future-ready solution for demanding interfacing requirements.

The ares evo is an advanced final test manipulator designed for automated, precise, and highly reliable test head positioning in semiconductor test environments. Built specifically for final test applications, it combines a robust mechanical platform with automated motion control, helping manufacturers reduce setup time, minimize manual intervention, and improve repeatability across a wide range of testing configurations.

With automated movement in x, y, z, and additional rotational axes, ares evo enables seamless and accurate positioning of test heads. This significantly simplifies the testing process compared to conventional final test manipulators and helps save time, labor, and operating costs.

Automated positioning for efficient final test

Unlike conventional manipulators that rely heavily on manual adjustment, ares evo allows automated movement across multiple linear and rotational axes. This makes positioning faster, easier, and more repeatable while reducing the risk of human error during setup and changeover.

Its integrated vision control and absolute value encoders ensure that every motion is precise and controlled, preventing deviations that could affect the integrity of the semiconductor components under test. With the push of a button, ares evo can automatically reposition the test head for the next phase of testing, reducing manual workload and helping manufacturers stay on schedule in high-demand production environments.

Designed for durability and flexible integration

ares evo is built for final test applications and features a durable, robust design that can be implemented across a broad range of testing configurations. Despite its strong load-handling capability, the system is engineered for the lowest possible floor load and requires no counterweights.

Its small footprint is achieved through intelligent cable management via a vertical pillar, making it especially suitable for space-conscious test floor layouts.

To support different application requirements, ares evo is available in configurations with different motion concepts and load capacities:

• Load capacity: 400 kg (882 lbs)
  With motorized motion for the z-axis, with optional electrical x- and y-axis and twist

• Load capacity: 750 kg (1,654 lbs)
  With motorized motion for x-, y-, and z-axis, plus twist

This flexibility allows users to select the right configuration based on their individual setup and automation requirements.

ares evo autodock

The ares evo autodock option adds automated docking functionality and includes all core ares evo features. It enables one-button control for position changes and uses force-based stop control for reliable and repeatable operation.

With absolute value encoders, autodock supports seamless and precise automated finding and positioning of test heads. If the handler is equipped with autolock or a CUH lock system, docking may not be required, further simplifying the overall handling process.

Key benefits of ares evo autodock include:

• One-button position change

• Force-based stop control

• Precise automated finding and positioning

• High position repeatability

• Reduced need for manual operation

• Optional fully automatic mode via remote control
  

ares evo autosetup

The ares evo autosetup option is designed for applications where test equipment such as probers or handlers is frequently replaced or repositioned. It includes all ares evo core features and adds a vision camera system for automatic detection of the equipment position.

This significantly reduces setup time and helps avoid alignment errors, making autosetup especially valuable in environments with changing hardware configurations or frequent retooling.

Key benefits of ares evo autosetup include:

• Automatic position detection of prober or handler

• Reduced setup time

• Lower risk of alignment errors

• Improved repeatability across changing configurations
  

Motion and positioning performance

ares evo offers a wide range of controlled linear and rotational motion to support precise final test setup requirements:

• Horizontal travel (x-axis): 200 mm (7.9")

• Horizontal travel (y-axis): 440 mm (17.4")

• Vertical travel (z-axis): 365 mm (14.4")

• Tumble adjustment: 3°

• Rotation: 180°

• Twist: 180°

• Theta adjustment: \pm 0.3°

These motion capabilities allow the manipulator to adapt accurately to individual setup conditions and test cell layouts.

Key benefits

• Advanced final test manipulator for automated positioning

• Automated movement in x, y, z, and additional rotational axes

• Vision control and absolute value encoders for precise motion

• Reduced setup time and less manual intervention

• Improved repeatability and lower risk of human error

• Durable and robust design for a wide range of configurations

• Low floor load without counterweights

• Small footprint through vertical cable management

• Available with 400 kg or 750 kg load capacity

• autodock option for automated position change and docking control

• autosetup option with vision-based equipment detection

• Optional fully automatic mode via remote control
  

The ares evo is a next-generation final test manipulator that combines robust mechanics, precise automated motion, and intelligent setup support in one high-performance platform. Whether configured with autodock, autosetup, or both, it helps semiconductor manufacturers improve efficiency, reduce manual effort, and achieve highly repeatable final test positioning in demanding production environments.

The titan is a durable and highly versatile universal test manipulator designed for reliable use across a wide range of semiconductor test configurations. Combining robust mechanical design with advanced motion control, titan supports demanding handling tasks while offering high flexibility for different load capacities, setup scenarios, and automation requirements.

Engineered for universal test applications, titan provides a stable and adaptable platform for precise test head positioning and efficient operation on the test floor.

Built for universal test applications

The titan is dedicated to universal test environments and is designed to perform reliably in a broad variety of testing configurations. Its robust construction makes it suitable for demanding day-to-day use, while its flexible feature set allows it to be adapted to individual customer setups and operational needs.

A key design advantage is its spring-assisted winch system, which eliminates the need for a counterweight. This reduces the overall floor load and simplifies integration into different test floor layouts.

Advanced motion control and compliance

titan is equipped with electric x-, y-, and z-axis movement, as well as twist and swing functions, enabling precise and controlled positioning of test heads. Its spring-assisted twist/theta compliance further supports smooth alignment and handling performance.

For additional flexibility, the tumble axis is available as an optional feature and can be configured as manual or electric, depending on the application.

This combination of powered movement and configurable compliance makes titan a strong fit for customers who require precise positioning together with robust mechanical support.

Flexible load capacity options

To support different equipment sizes and application requirements, titan is available with multiple load capacity classes:

• Load capacity up to 450 kg (992 lbs)

• Load capacity up to 750 kg (1,654 lbs)

• Load capacity up to 1,100 kg (2,425 lbs)

These options allow titan to be tailored to a broad spectrum of universal test applications, from medium-duty to high-load setups.

titan autodock

The titan autodock option adds automated positioning functionality and includes all standard titan features. With one-button control, position changes can be performed quickly and repeatably, supported by force-based stop control for reliable movement and alignment.

Integrated absolute value encoders allow seamless and precise automated finding and positioning of test heads. If the handler is equipped with autolock or a CUH lock system, docking may not be required, which further simplifies operation and improves workflow efficiency.

Key benefits of titan autodock include:

• One-button position change

• Force-based stop control

• Absolute value encoders for precise automated positioning

• High position repeatability

• Elimination of manual operation

• Optional fully automatic mode via remote control
  

titan autosetup

The titan autosetup option is intended for environments in which test equipment such as probers or handlers is frequently changed or repositioned. It includes all standard titan features and adds a vision camera system for automatic detection of equipment position.

This reduces setup time and helps prevent alignment errors, making titan autosetup particularly useful in dynamic test environments with changing equipment configurations.

Key benefits of titan autosetup include:

• Automatic detection of test equipment position

• Reduced setup time

• Reduced risk of alignment errors

• Improved repeatability in changing setups
  

Motion and performance data

titan offers a broad range of movement for precise positioning and flexible setup adaptation:

Linear drive

• Horizontal travel (x-axis): 200 mm (7.9")

• Horizontal travel (y-axis): 420 mm (16.5")

• Vertical travel (z-axis): 1,200 mm (47.2")

Rotation

• Tumble: 360°

• Column rotation: 290° (\pm5°)

• Twist: 180°

• Theta: 2°

These movement capabilities allow titan to handle complex setup requirements while maintaining reliable accessibility and precise positioning.

Key benefits

• Dedicated universal test manipulator

• Durable and robust design for a wide range of configurations

• Spring-assisted winch system with no counterweight required

• Reduced floor load

• Electric x, y, and z axes

• Twist and swing functionality

• Spring-assisted twist/theta compliance

• Optional manual or electric tumble axis

• Available with 450 kg, 750 kg, or 1,100 kg load capacity

• autodock option for automated position change

• autosetup option with vision-based position detection

• Optional full-automatic remote control mode

• Numerous additional features for individual setup requirements
  

The titan is a powerful and flexible universal test manipulator built for semiconductor environments that require robust mechanics, precise motion control, and configurable automation options. With multiple load capacities, optional autodock and autosetup functionality, and a design focused on reduced floor load and broad adaptability, titan delivers a reliable solution for a wide variety of test floor requirements.