helix-e docking
Exhibitor
esmo AG
The helix-e docking system is a high-precision, software-controlled docking solution designed for reliable alignment, stable contact force, and efficient integration in semiconductor test environments. With its modular architecture, adjustable z-stack, and fine-tuning capabilities in the docked state, helix-e offers a flexible and robust solution for demanding docking applications.
Engineered for stability and repeatability, the system is available in two performance classes — helix-e 30 and helix-e 150 — to support different force and application requirements.
Stable modular design
The helix-e docking system features four docking modules mounted on a rigid base plate, creating a mechanically stable platform for precise and repeatable docking processes. Four guide bushings provide reliable pre-alignment and support accurate positioning before final docking.
Its robust design ensures maximum system stability and compatibility with most common test head types used in the field, making it a practical solution for a broad range of semiconductor test setups.
The system is also designed for simple and efficient installation. In most applications, installation can be completed without the need for an alignment jig, helping reduce setup effort and integration time.
Intelligent control and precise adjustment
A key advantage of helix-e docking is its adjustable, software-controlled z-stack. All four modules are electrically synchronized, ensuring coordinated movement and precise positioning throughout the docking process.
Each module includes individual z-position measurement, allowing highly accurate monitoring and control. The system also supports teach-in functionality for the z stop position, enabling repeatable setup tailored to the specific application.
To simplify alignment relative to the handler, helix-e provides parallel alignment capability as well as fine adjustment of the docking stop position while in the docked state. This means adjustments can be made without undocking, saving time and improving operational efficiency.
For applications requiring additional mechanical reference, an optional mechanical hard stop can also be implemented.
Performance tailored to application needs
helix-e 30
Designed for applications requiring a lower contact force with high accuracy and stability:
Locking force per module: 30 kgf (approx. 294 N)
Total locking force (4 modules): 120 kgf (approx. 1176 N)
Dock adjustment range: 0.0 to 5.0 mm
Dock time: less than 18 seconds
Docking accuracy: \pm 0.05 mm
Repeatability (x, y): \pm 0.05 mm
Repeatability (z):
\pm 0.02 mm (software-controlled)
\pm 0.01 mm (with hard stop)
helix-e 150
Designed for higher-force applications requiring maximum holding power and fast docking performance:
Locking force per module: 150 kgf (approx. 1470 N)
Total locking force (4 modules): 600 kgf (approx. 5880 N)
Dock adjustment range: 0.0 to 6.5 mm
Dock time: less than 12 seconds
Docking accuracy: \pm 0.05 mm
Repeatability (x, y): \pm 0.05 mm
Repeatability (z):
\pm 0.02 mm (software-controlled)
\pm 0.01 mm (with hard stop)
Key benefits
Four-module docking system on a rigid base plate
High mechanical stability for precise and repeatable docking
Software-controlled adjustable z-stack
Electrical synchronization of all modules
Individual z-position measurement on each module
Teach-in function for z stop position
Fine adjustment in docked state without undocking
Optional mechanical hard stop
Compatible with most common test head types
Efficient installation, typically without alignment jig
Available in two force classes for different application needs
The helix-e docking system combines robust mechanics, precise software control, and application-oriented flexibility in one advanced docking solution. Whether the priority is compact force-controlled docking or high-force performance with maximum stability, helix-e provides the accuracy, repeatability, and ease of adjustment required for modern semiconductor test environments.
