Applying photoresist, anti-reflective or polyimide coating to microelectronic substrates by spin coating often leads to the formation of so-called edge beading. This is the unwanted accumulation of the coated material on the outer edges of the substrate in the form of a bump. These accumulations can also wrap around the edge of the substrate and thereby also contaminate the edges of the back side of the substrate. If the edges of the wafers are not cleaned, the dried particles or photoresist residues can flake off, causing particle contamination and other problems in subsequent manufacturing and process steps. Therefore, the unwanted residues on the outer areas of the substrate should be removed. Special devices exist for this purpose.