SEMICON West 2026Products & Services Precision wafer scriber MR 200
Precision wafer scriber MR 200
Exhibitor
OEG GmbH
The setup and the equipment of MR 200 enable high precision scribing for defined cutting of structured silicon wafers. The MR 200 is an indispensable tool, in particular for REM preparations in semiconductor technology. The MR 200 is also suited for singling of chips in low numbers, for example in laboratory use.
Precision Wafer Scriber MR200