Surface tension of photolithographic materials like resist and developer has a great potential for the photolithographic process itself. For instance, homogeneity of spin coatings, planarization, and adhesion depend directly on surface tension of the materials involved. The SURFTENS WH 300 contact angle meter serves for the measurement of contact angle and surface free energy (SFE) in semiconductor technology and provides the complete functionality, which is required in 300mm wafer fab´s. This makes the device unique worldwide

Main features of SURFTENS WH 300

-3 axis wafer handling robot

-load port for 12”-Wafer FOUP

-SECS / GEM interface

-optional bridge tool for 200mm FOUP

-video system for automatic drop shape analysis

-wafer scanner

-centring & notching before measurement

-automatic, software-controlled dosing system

-tank for main dosing system (DI water)

-automatic, software-controlled refill of main dosing system

-optional second dosing system for other test liquids

-filter fan unit

-optional hotplate for evaporating of water drops

-optional additional optical sensor for resist edge analysis

- single cable connection to the main power distribution unit of the instrument

- EMO is integrated