The scia Trim systems are high-volume production systems for high-precision surface trimming of wafers. They are used to achieve high-quality surface structures without limitations on film and wafer materials. The machine layout is optimized for high throughput and low maintenance.

The scia Trim systems guarantee film thickness homogeneity to an atomic level of 0.1 nm. Unlike conventional mechanical polishing methods, ion beam trimming operates without physical contact. Therefore, it prevents mechanical stress or damage to surrounding areas, increasing the device's reliability.