3D-Micromac designed the microVEGA  FC system for high-precision laser processing of semiconductor wafers during continuous motion. With 3D calibration, dynamic focus correction, and a positioning accuracy of 150 nm at 400 mm/s, the system delivers top-level precision at the highest throughput.

It combines speed, accuracy, and stability for the most demanding laser processing tasks. Its user-friendly control and seamless integration into existing production lines ensure maximum availability and support long-term process efficiency while keeping unit costs low.

Typical applications include trimming digital potentiometers, programming logic structures, or repairing embedded memory cells—but a lot more is imaginable. Let's get in contact to discuss your application that needs ultra-precise laser processing.