SEMICON West 2025Products & Services In-Process Wafer Thickness Monitoring for Grinding Applications
In-Process Wafer Thickness Monitoring for Grinding Applications
Exhibitor
Precitec 3D Metrology
Precitec’s 3D metrology solutions enable precise, non-contact thickness control during wafer thinning and structuring – even in harsh environments with grinding slurry.
Key Advantages:
• Accurate TTV measurement across wide thickness/material ranges
• Suitable for Si, SiC, GaN, InP, sapphire, LiTaO, and more
• Water-/acid-resistant probes and water jet sensors for low maintenance
• Designed for seamless OEM integration into process tools
Ensure consistent quality and reduce costs with robust in-line metrology.
Precitec 3D Metrology solutions for raw grinding, polishing and back side grinding