We now offer a Vacuum Solder oven with overpressure function. It allows the either overpressure up to 200mbar or optional up to 2000 mbar.
A significant improvement in the quality of the joining technologies is achieved by increasing the reliability of the solder joints and reducing heat dissipation. The soldering furnace technology in combination with an overpressure module enables cavity-free solder joints. The substrate size is from 300mm up to 600x600mm