UniTemp GmbH
Booth number: 1261-22
www.unitemp.de
About us
The company UniTemp GmbH was founded in August 2000. The corporate of objective is the development, manufacturing, sales and marketing of equipment for microelectronics. 1. In the beginning the UTP series started the successful way of Rapid Thermal Annealing ovens. Meanwhile this kind of oven has been improved and the new RTP and VPO series are well established on a world wide operating market. The key features of these ovens are fast ramp up rates (up to 200 K/sec up to 1200 °C) and its working size (up to 300mm wafer size). 2. Beside these ovens UniTemp is a specialist for reflow solder systems (RSS and VSS series) with a wide variety of options and accessories. 3. Another corporate of objective was the development of a semi automatic wire bonding machine, model WB-300-U.
Address
Luitpoldstr. 6
85276 Pfaffenhofen an der Ilm
Germany
E-mail: astrid.birkner@unitemp.de
Phone: +49 152 29505877
Internet: www.unitemp.de
1105 Arboretum Dr.
28405 Wilmington NC
United States
E-mail: patrice.frau@npos-usa.com
Phone: +1 62 64711207
Internet: www.npos-usa.com
Contact person:
Astrid Birkner
Founder and CEO
E-mail: astrid.birkner@unitemp.de
Phone: +49 152 29505877
Products & Services
Vacuum Solder System with overpressure function
We now offer a Vacuum Solder oven with overpressure function. It allows the either overpressure up to 200mbar or optional up to 2000 mbar.
A significant improvement in the quality of the joining technologies is achieved by increasing the reliability of the solder joints and reducing heat dissipation. The soldering furnace technology in combination with an overpressure module enables cavity-free solder joints. The substrate size is from 300mm up to 600x600mm
RTP-200 for 8" wafer size
This is quite new in our portfolio and closes the gap between the 6" and 12" system.
It accepts a 8" wafer for single processing. We offer a standard unit or a high vacuum option. All kind of features are available.
VPO-300 vacuum oven for 300mm wafer size with an universal process hood, e.g. for use of pure Hydrogen
RTP Oven for Semiconductor processes
Fast ramp up process ovens with vacuum for semiconductor processes
Reflow Solder Systems
Table Top reflow solder system for fluxfree and void free soldering results. Solder area from 110x110mm up to 210x210mm substrate size. Up to 400°C , optional up to 500°C, with gas flow control and SIMATIC touch screen
Semiautomatic wire bonder WB-300-U
Manual and semiautomatical wire bonder for wedge and ball bonding , perfect lab tool for small series and development
