RCplus - Precision surface grinding machine especially for hard, brittle and difficult to process materials such as SiC, Si3N4, AlN, Al2O3, GaN etc.

MPS R400 CV TWIN - Precision surface grinding machine for grinding semiconductor materials with highest flatness accuray

ECO 500 - Chemical-mechanical polishing technology (CMP) with precise process control

IDS 22plus - Automatic compact Inner Diameter Saw for machining II/VI, III/V-compound semiconductors and other special materials