The Milara EFEM (Equipment Front End Module) is a system designed to maximize productivity of semiconductor processing equipment tools that require the highest level of automation. The Load Port is modular and can seamlessly integrate to the OEM process tools. Milara’s EFEM can be customized to meet the automation requirements of any semiconductor manufacturing facility, adding stations such as pre-aligners and OCR. Capable of handling various wafer sizes with 1-5 load ports or custom cassette holders. Milara’s Process and EFEM modules are built to customer specification to meet specific system and layout requirements. All components of the system are ISO 3 (ISO14644) / Class 1 (FED STD 209E) Clean room compliant and the optional fan filter unit built into the mini-environment can provide laminar flow for maximum cleanliness.

• Highly customizable design for meeting all your production needs.

• Modular design with vibration isolation, ensuring independence from any type of wafer processing, inspection and measurement.

• One to five Load Port configuration and/or up to 24 open cassettes for 100mm-200mm wafers. EFEM can be configured as a “bridge tool” for FOUPs and open cassettes of various sizes.

• Depending on the Load Port configuration, the Milara EFEM can handle 300mm wafers exclusively, Film-Frame substrates exclusively, or a combination of both.

• Industry-standard SEMI BOLTS interface allows for mounting of load ports, process modules, measurement and other equipment.

• Milara’s EFEM can include a Fan Filter Unit providing mini-environment laminar flow for maximum cleanliness.

• Full line of autonomus Wafer Prealigners centering from 50mm to 300mm wafers with 20 microns accuracy or better

• Through the wall or Ball Room mounting.

• Optional SECS/GEM interface.

• High-throughput and reliable Milara single or dual arm robot for fast wafer swapping.

• OCR integrated within the prealigner module reliably track IDs on both sides of the substrate.

• Option to integrate digital scale, measurement, or inspection equipment within the EFEM frame.

• Variety of end effector options including vacuum gripping and edge gripping. End Effectors include integrated through-beam sensor for quick and reliable wafer mapping as well as reporting for: occupied slots, empty slots, and cross-slotted substrates.

• Clean Linear track with linear motors.

• ISO 3 (ISO 14644) / Class 1 (FED STD 209E) Clean room compliant.

• CE compliant.

• Compliant with SEMI standards.

• Reliability – MTBF > 60,000 hours, (MCBF > 10,000,000 cycles).

• Monitor and Keyboard.

• Wafer Flipping (optional).

• Powder coat or stainless-steel finish.

The H4 series atmospheric robots represent a significant engineering advancement in the design and reliability of wafer handling equipment.
Two independent arms (R1 and R2) attached to a common rotary axis (T) allow fast swapping or simultaneous transfer of two wafers.
Benefiting from technologically superior components, the robots utilize ultra low inertia, high-response brushless servomotors coupled with zero-backlash Harmonic Drive® gears to achieve greatly enhanced dexterity and precision.
The innovative, all-in-one, design incorporates the motion controller, servo amplifiers, and power supply within the robot’s industry standard footprint.
High-strength structural members enable top, bottom or side mount configurations without compromising the system rigidity.
A 32-bit, real-time kernel delivers accurate motion profiling along smooth continuous trajectories, while the distributed control architecture allows a seamless integration with linear tracks, pre-aligners, and other sub-components.
Networkable RS-485 and Ethernet interfaces complement the standard RS-232 and teach pendant connections. Powerful native wafer handling and scripting languages facilitate rapid software development for embedding the robots into an OEM application environment.
Comprehensive emulation of legacy robot “macro” commands offers a drop-in compatibility with a wide variety of existing semiconductor tools.

• Excellent structural rigidity.

• Modular and highly customizable design.

• Arm length from 10.50” and 20”.

• Vertical travel from 13 up to 22”.

• Fully integrated motion controller, servo amplifiers and power supply.

• High response brush-less motors and precise zero-backlash Harmonic Drive® gears Absolute encoders eliminating the initial homing procedure.

• Handling radial and in-line equipment placement.

• Seamless integration with prealigner, linear track and other peripheral components.

• Standard RS-232 interface and Ethernet (Telnet) interfaces to the host computer.

• Advance 32-bit real-time motion control kernel, Powerful wafer handling firmware.

• Comprehensive software tools and utilities.

• Software emulation for legacy robot macro commands, Optional teach pendant terminal.

• General purpose digital inputs and outputs for custom use.

• Reliability – MTBF > 60000 hours, (MCBF > 10,000,000 cycles)

The H3 series atmospheric robots represent a significant engineering advancement in the design and reliability of wafer handling equipment.
Benefiting from technologically superior components, the robots utilize ultra low inertia, high-response brushless servomotors coupled with zero-backlash Harmonic Drive® gears to achieve greatly enhanced dexterity and precision.
The innovative, all-in-one design incorporates the motion controller, servo amplifiers, and power supply within the robot’s industry standard footprint.
High-strength structural members enable top, bottom or side mount configurations without compromising the system rigidity.
A 32-bit, real-time kernel delivers accurate motion profiling along smooth continuous trajectories, while the distributed control architecture allows a seamless integration with linear tracks, pre-aligners, and other sub-components.
Networkable RS-485 and Ethernet interfaces complement the standard RS-232 and teach pendant connections. Powerful native wafer handling and scripting languages facilitate rapid software development for embedding the robots into an OEM application environment.
Comprehensive emulation of legacy robot “macro” commands offers a drop-in compatibility with a wide variety of existing semiconductor tools.

• Excellent structural rigidity

• Modular and highly customizable design

• Arm length from 10.50” up to 23.62”

• Vertical travel from 13″ up to 22”

• Fully integrated motion controller, servo amplifiers and power supply

• High response brushless motors and precise zero-backlash

• Harmonic Drive® gears

• Optional absolute encoders eliminating the initial homing procedure

• Handling radial and in-line equipment placement

• Seamless integration with prealigner, linear track and other peripheral components

• Standard RS-232 interface and Ethernet (Telnet) interfaces to the host computer

• Advance 32-bit real-time motion control kernel

• Powerful wafer handling firmware

• Comprehensive software tools and utilities

• Software emulation for legacy robot macro commands

• Optional teach pendant terminal

• General purpose digital inputs and outputs for custom use

• Reliability – MTBF > 60,000 hours, (MCBF > 10,000,000 cycles)

Milara Smart Prealigner offers industry leading alignment precision using a high-resolution encoder. The aligner unit features RGB and IR light sources allowing easier and faster edge detection for semi-transparent and glass carriers. The moving lighthouse allows alignment of square and round substrates with non-standard sizes. Milara Smart Prealigner is equipped with with self-calibration and self-diagnostic capabilities. A web interface with M2M communication capability for smart manufacturing and automation is at your disposal. Wide variety of Chuck and Pin materials are available – Peek, Tekapeek ELS nano, Semitron ESD420, Viton, Kalrez, Ceramic, etc.

The latest generation high-throughput wafer sorting platform from Milara Inc. It brings to market innovative and fully automated cassette stations, which provide a complete system from the loading of new substrates through the unloading of processed substrates without interrupting the robot cycle. This enables unparalleled processing throughput of more than 220 wafers per hour. A modular design allows for the processing of up to 20 carriers simultaneously and central to the system is Milara’s Diamond H4 dual-arm robot for rapid wafer swapping. End effectors on the robot include integrated through-beam sensors for quick and reliable wafer mapping, reporting occupied or empty slots, and identifying cross-slotted substrates. Fully integrated precision wafer handling components include an autonomous pre-aligner to center wafers with 20 micron accuracy, an optical character reader to reliably track ID’s on both sides of the substrate, and high-precision digital scales capable of measuring a wafer in one half of a second with 1 milligram resolution. All components of the system are ISO 3 (ISO14644) / Class 1 (FED STD 209E) Clean room compliant and the optional fan filter unit built into the mini-environment can provide laminar flow for maximum cleanliness.

During time-controlled fix-process sequences, idle time pockets occur, often dictated by the slowest process step, impacting overall tool throughput.  Solutions include buffer stations for wafer storage and multi gripper systems for efficient robot travel. Original Equipment Manufacturers (OEMs) seek shorter cycle times while maintaining precision standards. Milara's HyperMation features self-learning algorithms used in project phases via process simulation with digital twins of semiconductor equipment, optimizing layout, cycle times, and module compositions. The aim is to eliminate idle times and maximize module utilization, tailoring algorithms to each machine's unique layout and processes.