mechatronic wafer packer (mPT)

The fully automated wafer packer (mPT) for packing and unpacking of substrates into shipping boxes or from shipping boxes represents the latest generation of wafer packers with the highest level of flexibility for substrate types, substrate sizes and material types in combination with the highest reliability. Consistent implementation of mechatronic´s modular design concept and a sophisticated sensor technology guarantee full compatibility with the widest variety of wafer carriers (including open cassettes, FOUPs, FOSBs) and packing material (foam, interleave, ring separators). mechatronic systemtechnik gmbh´s packer mPT is designed to enable a safe and reliable packing process, in combination with host notification of cassette ID and substrate ID. mechatronic packing chuck is the centerpiece of mPT providing the biggest number of available functions in the industry.

mechatronic ring remover (mRR) & laser cutter (mLC)

The mechatronic ring remover offers precise and efficient removal of rings from wafers, ensuring a smooth and reliable process. It is equipped with advanced sensors and control systems to handle various types of rings and wafers with high accuracy.On the other hand, the mechatronic laser cutter provides precise and clean cutting of wafers, enabling customization of wafer sizes and shapes with exceptional precision. It utilizes state-of-the-art laser technology to achieve accurate cuts without causing damage to the substrate.

mechatronic wafer sorter (mWS)

The mechatronic systemtechnik gmbh wafer sorter (mWS) series represents the latest generation of wafer sorters, establishing new standards in the safe handling of complex substrates such as thin, ultra-thin, or warped wafers. The consistent implementation of the modular design concept ensures complete compatibility with a diverse range of wafer carriers. The mWS sorters from mechatronic systemtechnik gmbh can be configured as a flexible solution for transfer, sorting, splitting, and merging operations. This series of wafer sorting systems has the capability to entirely eliminate manual wafer handling in today's semiconductor fabrication.

mechatronic wafer loader (mWL)

More than 25 years, mechatronic systemtechnik gmbh has been a trusted partner to various process and metrology equipment makers, enabling them to address non-standard handling requirements for emerging technologies and non-standard substrates. Wafer loaders from mechatronic systemtechnik gmbh offer the highest level of performance and capabilities, while reducing wafer transfer time significantly. Our systems are designed to be versatile and modular, are capable of handling multiple wafer types and sizes in one platform and can address complex handling requirements at the highest levels of safety and reliability. We welcome challenges and committed to deliver solutions as per our customer requirement. mechatronic systemtechnik gmbh has already developed all capabilities and expertise to meet complex wafer handling requirements. We work closely with OEM customers to deliver the solution and technologies needed to enable their success. 

mechatronic wafer loader neo (mWL neo)

As a further development of the "classic" mWL, the mWL neo represents an optimal opportunity to operate in an even more versatile way. For that, mechatronic systemtechnik gmbh has moved the complexity of critical handling components to the modules and the software framework. Our mWL neo can support simple as well as complex handling requirements.