PLANOPTIK AG
About us
PLANOPTIK sets global standards with glass-based solutions for the semiconductor industry, microsystems, and microfluidics with manufacturers in over 40 countries. PLANOPTIK creates customized products that support cutting-edge sensors, microelectronics, and medical diagnostics.
In advanced packaging, PLANOPTIK’s glass core substrates enable ultra-compact microchip arrangements, enhancing performance, energy efficiency and device miniaturization. Its high-precision glass micro circuit boards are key for future semiconductor advancements, using copper-coated, lithographically processed glass for critical connections.
PLANOPTIK collaborates with its customers to design and produce high-volume, wafer-based components, offering solutions from glass wafers to thin-wafer handling tools.
Address
Über der Bitz 3
56479 Elsoff
Germany
E-mail: info@planoptik.com
Phone: +49 2664 50680
Internet: www.planoptik.com
Contact person:
Jonas Discher
E-mail: j.discher@planoptik.com
Carsten Wesselkamp
E-mail: carsten.wesselkamp@planoptik.com
Products & Services
Carrier Wafers
Designed for safe processing of ultra-thin wafers
Customized to customer-specific process requirements
Reusable and highly stable glass-based carriers
Wafer-Level Packaging
Glass lids for protecting sensors and semiconductor devices
Available with cavities, structures, and alignment features
Proven technology used in millions of packaged devices
Advanced Packaging / Glass-Core Substrates
High-performance substrates for next-generation interposers
Excellent signal integrity and thermal behavior
Compatible with fine-pitch metallization and RDL processes
Substrate Wafers
Glass and quartz wafers for MEMS and semiconductor applications
Broad portfolio of materials and processing capabilities
Tailored surface and structural features on request