SEMICON West 2025German Exhibitors PLANOPTIK AG

PLANOPTIK AG

www.planoptik.com

About us

PLANOPTIK sets global standards with glass-based solutions for the semiconductor industry, microsystems, and microfluidics with manufacturers in over 40 countries. PLANOPTIK creates customized products that support cutting-edge sensors, microelectronics, and medical diagnostics.

In advanced packaging, PLANOPTIK’s glass core substrates enable ultra-compact microchip arrangements, enhancing performance, energy efficiency and device miniaturization. Its high-precision glass micro circuit boards are key for future semiconductor advancements, using copper-coated, lithographically processed glass for critical connections.

PLANOPTIK collaborates with its customers to design and produce high-volume, wafer-based components, offering solutions from glass wafers to thin-wafer handling tools.

Address

PLANOPTIK AG
Über der Bitz 3
56479 Elsoff
Germany

E-mail: info@planoptik.com
Phone:  +49 2664 50680
Internet: www.planoptik.com

Contact person:

Jonas Discher
E-mail: j.discher@planoptik.com

Carsten Wesselkamp
E-mail: carsten.wesselkamp@planoptik.com

Products & Services

Semiconductor Manufacturing & Processing
Wafer & Substrate Materials
Micro- & Nanotechnology
Advanced Packaging & Assembly

Carrier Wafers

  • Designed for safe processing of ultra-thin wafers

  • Customized to customer-specific process requirements

  • Reusable and highly stable glass-based carriers

Wafer-Level Packaging

  • Glass lids for protecting sensors and semiconductor devices

  • Available with cavities, structures, and alignment features

  • Proven technology used in millions of packaged devices

Advanced Packaging / Glass-Core Substrates

  • High-performance substrates for next-generation interposers

  • Excellent signal integrity and thermal behavior

  • Compatible with fine-pitch metallization and RDL processes

Substrate Wafers

  • Glass and quartz wafers for MEMS and semiconductor applications

  • Broad portfolio of materials and processing capabilities

  • Tailored surface and structural features on request

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